发明名称 METHOD OF MANUFACTURING DEVICE INCLUDING PART COVERED WITH COATING LAYER, AND COATING LAYER REMOVING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a device including a part covered with a coating layer, and a coating layer removing device. SOLUTION: In a first laser processing unit and a second laser processing unit, a carrier bar 11 is moved up and down so as to irradiate a predetermined range with a laser beam based upon a shift amount calculated through image processing of individual capacitor elements 2a, 2b and 2c and a position of the carrier bar 11 through processing of the capacitor elements 2a, 2b and 2c right before that. The first laser processing unit removes a part, covering a substantially half circumference of the anode lead member, of a part of a dielectric film and a conductive polymer film which covers the entire circumference of the anode lead member, and the second laser processing unit removes the remaining part of the dielectric film and conductive polymer film which covers a substantially half circumference of the anode lead member. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011049280(A) 申请公布日期 2011.03.10
申请号 JP20090195328 申请日期 2009.08.26
申请人 SANYO ELECTRIC CO LTD 发明人 FUJII EIZO;UMEDA MASASHI;NISHIUCHI KANAME
分类号 H01G13/00;H01G9/00;H01G9/052 主分类号 H01G13/00
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