WATER-RICH STRIPPING AND CLEANING FORMULATION AND METHOD FOR USING SAME

摘要

PURPOSE: A water-rich stripping and cleaning formulation is provided to stabilize hydroxylamine, to control an Al etching rate, and to remove contaminants from a semiconductor substrate using the same. CONSTITUTION: A water-rich stripping and cleaning formulation comprises: from 1 to 30 % by weight of a component selected from a hydroxylamine, a hydroxylamine salt compound, and mixtures thereof; from 0.1 to 5 % by weight of a corrosion inhibitor containing a mixture of alkyl dihydroxybenzene and hydroxyquinoline; from 5% to 45% by weight of a component selected from an alkanolamine which is miscible with the hydroxylamine, a water-soluble solvent, and mixtures thereof; and at least 50% by weight of water.