| 摘要 |
PROBLEM TO BE SOLVED: To achieve automation for removing an adhesive, by appropriately performing the removal of the overflow adhesive after bonding a work to a slicing table. SOLUTION: The process of bonding the work 4 to an adhesive surface 2 of the slicing table 1 by coating the adhesive surface 2 of the slicing table 1 with the adhesive 3 and by pressing the work 4 to the part of the adhesive 3 on the adhesive surface 2 includes a step of pressing, before coating with the adhesive 3, a tape 5 for removing the adhesive to the side faces 6, which are the cutting edge of a wire saw 10 and in the state of facing, among the side faces 6, 7 of the slicing table 1; a step of receiving the adhesive 3, which is overflowed from the space between the work 4 and the slicing table 1 by bonding the work 4 to the slicing table 1, on the surface opposite to the pressing surface of the tape 5; and a step of removing the overflowed adhesive 3 from the side face 6, which is the cutting edge, together with the tape 5 by making the tape 5 evacuate. COPYRIGHT: (C)2011,JPO&INPIT |
