发明名称 MOLD
摘要 PROBLEM TO BE SOLVED: To improve mold releasability of a molding by installing an ejector pin in a mold using a lease film and to adsorb/hold a release film covering the ejector pin protruding from a mold parting surface by sticking it following the mold parting surface around the tip protrusion of the ejector pin. SOLUTION: The mold 100, with the release film 180 covering the ejector pin 140 protruding from the mold parting surface in a mold opening state sucked into an air suction passage through a clearance 190, is stuck following the mold parting surface around the tip protrusion of the ejector pin 140 to be adsorbed/held. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011046017(A) 申请公布日期 2011.03.10
申请号 JP20090194340 申请日期 2009.08.25
申请人 APIC YAMADA CORP 发明人 SAITO TAKASHI
分类号 B29C45/34;B29C33/68;B29C45/14 主分类号 B29C45/34
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