| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board and a method for manufacturing the same which enhance the connection reliability between a conductor and copper wirings. SOLUTION: The wiring board includes an insulating layer 1, copper wirings 2 stacked on both faces of the insulating layer 1, a through-hole 4 penetrating the insulating layer 1 and the copper wirings 2, and a solder conductor 11 which is charged in the through-hole 4 and has both ends protruding more than the copper wirings 2, which are coating-jointed to a part of a surface of the copper wirings 2, in the vicinity of the through-hole 4. A jointing intermediate layer 27, which is metal-jointed to each of the copper wirings 2 and the solder conductor 11, is formed at both interfaces between the copper wirings 2 and the solder conductor 11. COPYRIGHT: (C)2011,JPO&INPIT
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