发明名称 STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide a structure capable of stably holding an inorganic filler powder such as a thermal conductive inorganic filler powder at a high density and in a uniformly dispersed state, having high shape retentivity, and showing excellent adhesion even to a rugged surface. <P>SOLUTION: The structure 6 having shape retentivity includes a mixture of a needle-like or slip-like inorganic base powder with a needle-like or slip-like part extending in three-dimensional directions and an inorganic filler powder having the same particle diameter as the inorganic base powder or a smaller particle diameter than the inorganic base powder. The volume of the mixture is reduced to &le;70% of the total volume of the inorganic base powder and the inorganic filler powder, and the structure 6 is obtained by shaking a preliminary mixture of the inorganic base powder and the inorganic filler powder. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011046922(A) 申请公布日期 2011.03.10
申请号 JP20100114127 申请日期 2010.05.18
申请人 HARIMA CHEMICALS INC 发明人 IWAMATSU MASAKI
分类号 C09K5/08;C22C1/05;C22C29/12;C22C32/00;H01L23/36;H01L23/373 主分类号 C09K5/08
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