发明名称 MULTILAYER ELECTRONIC COMPONENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multilayer electronic component having reliability improved by preventing connection conductors from entering a region on an inner circumferential side of a coil, while reducing the DC resistance. <P>SOLUTION: The diameter of a first parallel connection through-hole conductor 65 is made larger than that of a lead-out conductor through-hole conductor 71, thereby enabling the first parallel connection through-hole conductor 65 to function as a supporting member for receiving encroachment of the lead-out conductor through-hole conductor 71 at lamination press fitting. As a result of this, a conductor end portion 21b of a first connecting conductor 21 and a conductor end portion 23b of a second connection conductor 23 can be prevented from sinking. Furthermore, the area of a portion where the first parallel connection through-hole conductor 65 abuts against the conductor end portion 23b of the second connecting conductor 23 is made large so as to make the pressure acting on the conductor end portion 23b dispersed. Accordingly, the amount of encroachment of the first parallel connection through hole conductor 65 is reduced for the conductor end portion 23b of the second connecting conductor 23. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011049492(A) 申请公布日期 2011.03.10
申请号 JP20090198780 申请日期 2009.08.28
申请人 TDK CORP 发明人 OIDE AKIHIKO;OSHIMA YOSHIYA;YOSHINO MAKOTO;EBINA KAZUHIRO
分类号 H01F17/00;H05K3/46 主分类号 H01F17/00
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