| 摘要 |
A sputtering type deposition apparatus includes a chamber device and a target. The chamber device defines an access chamber, a first entrance from exterior to the access chamber, a depositing chamber, and a second entrance from the access chamber to the depositing chamber. The chamber device includes an access door, a separating door, and a carrier. The access door is disposed at the first entrance and configured to open or close the first entrance. The separating door is disposed at the second entrance and configured to open or close the second entrance. The carrier is disposed in the access chamber and configured to carry a substrate from the access chamber to the depositing chamber. The target is received in the depositing chamber.
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