| 摘要 |
A protective film forming method for forming a protective film of resin on the front side of a wafer to be laser-processed. The protective film forming method includes the steps of holding the wafer on a spinner table in the condition where the front side of the wafer is oriented upward, forming a water layer covering the front side of the wafer held on the spinner table, dropping a liquid resin onto the water layer at the center of the wafer, rotating the spinner table holding the wafer to scatter the water layer and radially spread the liquid resin dropped on the water layer, thereby forming a first resin film covering the front side of the wafer by a centrifugal force produced during rotation of the wafer, dropping the liquid resin onto the first resin film at the center of the wafer, and rotating the spinner table holding the wafer to radially spread the liquid resin dropped on the first resin film, thereby forming a second resin film covering the first resin film by a centrifugal force produced during rotation of the wafer. |
