METHOD OF FABRICATING A FINE PITCH METAL BUMP FOR FLIP CHIP PACKAGE

摘要

PURPOSE: A method for manufacturing a metal bump of a fine pitch for mounting a flip chip is provided to set the length of a pitch between metal bumps independent of an optical system by not using an optical pattern transfer method. CONSTITUTION: A solder resist(200) is formed on a substrate(100). The substrate includes a copper circuit on the surface of an outer layer. A plating resist is formed on the solder resist. The plating resist and the solder resist are removed by a UV laser irradiation. An opening is formed. A copper bump(130) is formed on a copper surface. A copper bump is formed by an electric copper plating. The plating resist is removed.