| 摘要 |
PROBLEM TO BE SOLVED: To improve the yield rate and productivity of a semiconductor module. SOLUTION: A sheet having electrical conductivity is stuck to a main surface of a semiconductor substrate which includes a surface structure and a back plate and on which a plurality of semiconductor elements are arranged. In the state that the sheet is stuck to the main surface, the semiconductor substrate is divided into semiconductor chips on a first support base. The plurality of divided semiconductor chips are mounted on a second support base via the sheet, and dynamic characteristic tests for the mounted plurality of semiconductor chips are carried out continuously on the second support base. Thereby, cracking which develops and propagates from cracks generated in the dynamic characteristic tests for the vertical semiconductor elements is suppressed, and the yield rate and productivity of the semiconductor module are improved. COPYRIGHT: (C)2011,JPO&INPIT |
