LED PACKAGE STRUCTURE FOR INCREASING HEAT-DISSIPATING EFFECT AND LIGHT-EMITTING EFFICIENCY AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A light emitting diode package structure and manufacturing method thereof are provided to reinforce the connection strength between the chip mounting soldering pads of tin paste and a base main body. CONSTITUTION: The top surface of the substrate main body comprises a first conduction solder pad(11a), a second conduction solder pad, and a chip mount solder pad. The alloy unit comprises the nickel palladium alloy formed on the chip mount solder pad. A light emitting unit(2) comprises the light emitting diode chip positioned on the nickel palladium alloy of the alloy unit by a tin ball or tin paste.