APPARATUS FOR CORRECTING POSITION OF WAFER, WAFER BONDER AND JIG FOR WAFER BONDER

摘要

PURPOSE: A wafer position correction apparatus, a wafer bonder, and a wafer bonder jig are provided to apply the stable pressure to the overall wafer during the wafer bonding by comprising the elastic member. CONSTITUTION: A wafer with the flat zone formed on the side is installed to a jig(150). A first guide pin(151) is installed on the jig and contacts the flat zone. A pressing unit is installed to be movable for the wafer. The pressing unit has a flexibility tip which presses the wafer. A second flexibility tip is arranged being spaced from the first flexibility unit and the first flexibility tip.