发明名称
摘要 A method and system are provided for fabricating three-dimensional (3D) structures having micron or submicron features. The method includes providing a continuously-formed relief structured material, the relief structured material having a first layer comprising a material having a pattern of relief structures formed on a first surface thereof. The structured material includes second layer comprising a photosensitive material that is disposed on the first layer. The relief structured material is exposed to radiation through the first layer, where the pattern of relief structures formed on the first surface of the first layer generates a 3-dimensional light intensity pattern of the radiation that is incident on the second layer. The exposed material is developed, where the developed material comprises a plurality of 3D structures having micron or submicron features.
申请公布号 JP2011507711(A) 申请公布日期 2011.03.10
申请号 JP20100539587 申请日期 2008.12.02
申请人 发明人
分类号 B81C1/00 主分类号 B81C1/00
代理机构 代理人
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