| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing method and its device with which an upper surface can pressure-contacts and by which the surface is polished by a prescribed number of times of revolutions of an object to be worked in a normal direction and the forward movement of a polishing tape and a lower surface can pressure-contact and can be polished by a prescribed number of times of revolutions of the object to be worked in an opposite direction and the return movement of the polishing tape. SOLUTION: A polishing device includes a holding and rotating mechanism (A) for holding the object W to be worked and rotating R the object to be worked in the normal direction or in the opposite direction, a pressure contact mechanism B for allowing a polishing surface T<SB>1</SB>of the polishing tape T to pressure-contact with a surface W<SB>1</SB>to be polished of the work to be worked, a tape moving mechanism C for moving forward M the polishing tape to the other tape reel from one tape reel 1 and returning N the polishing tape to the one tape reel from the other tape reel, and a control means D for moving forward the polishing tape in the opposite direction with respect to the rotating direction of the object to be worked in polishing the upper surface W<SB>11</SB>of the surfaces to be polished and returning the polishing tape in the opposite direction to the rotating direction of the object to be worked in polishing the lower surface W<SB>2</SB>of the surfaces to be polished. COPYRIGHT: (C)2011,JPO&INPIT |
