| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic circuit substrate whose cost can be reduced, and to provide a method of manufacturing the ceramic circuit substrate. SOLUTION: The ceramic circuit substrate includes a ceramic substrate 10, a terminal part 20 formed on the surface of the ceramic substrate 10, a plurality of via holes 21 bored in the ceramic substrate 10, and wiring 14 for connecting conductors 18 in the via holes 21 and the terminal part 20 to each other, the plurality of via holes 21 being arranged at positions along a concentric circle including the center of the ceramic substrate 10 in plan view as its center. COPYRIGHT: (C)2011,JPO&INPIT |
