发明名称 |
METHOD OF MANUFACTURING SPLIT GATE NONVOLATILE SEMICONDUCTOR STORAGE DEVICE, AND SPLIT GATE NONVOLATILE SEMICONDUCTOR STORAGE DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To decrease the number of processes of manufacturing a split gate nonvolatile storage device. SOLUTION: The split gate nonvolatile storage device includes: a substrate (2); a floating gate (5) formed on the substrate (2) via a gate insulating film (7); a control gate (6) formed by the floating gate (5) via a tunnel insulating film (8); a first source/drain diffusion layer (4) formed on the substrate (2) on the side of the control gate (6); a second source/drain diffusion layer (3) formed on the substrate (2) on the side of the floating gate (5); a channel region provided to the substrate between the first source/drain diffusion layer (4) and second source/drain diffusion layer (3); and a silicide (21) in contact with the second source/drain diffusion layer (3). COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2011049463(A) |
申请公布日期 |
2011.03.10 |
申请号 |
JP20090198311 |
申请日期 |
2009.08.28 |
申请人 |
RENESAS ELECTRONICS CORP |
发明人 |
ISHIGURO HISASHI |
分类号 |
H01L27/115;H01L21/8247;H01L29/788;H01L29/792 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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