| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive solder paste composition that is used for the circuit board of electronic equipment incorporated in personal computers, automobiles, portable telephone/mobile information terminal, flat panel television, game equipment, advanced road information system, wireless LAN or the like, is excels in storage stability, and does not produce residues after soldering, and to provide a solder composition obtained by curing the solder paste composition. SOLUTION: The photosensitive solder paste composition is characterized in that it contains (A) solder powder, (B) photoacid generator, and (C) resin. COPYRIGHT: (C)2011,JPO&INPIT |
