| 摘要 |
With little cost and time, this invention makes high-precision measurements over an entire surface of a substrate to check how well devices are fabricated. The devices include integrated circuits, magnetic heads, magnetic discs, solar cells, optical modules, light emitting diodes and liquid crystal display panels—the ones that are fabricated on a substrate by repetitively performing deposition, resist application, exposure, development and etching. The method of this invention involves inputting multipoint measured data and a number of points used for measurement and calculating measuring coordinates by the measuring coordinate calculation program 1161. Next, based on the calculated measuring coordinates, the measuring program 1162 measures device characteristics, such as dimensions of the devices. Next, the curved surface approximation program 1163 calculates approximated values of device characteristics over the entire surface of the substrate, followed by the output program 1164 outputting the approximated values.
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