| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate connecting structure that prevents poor connection due to a non-uniform temperature rise in a connection region of a circuit board during thermocompression bonding. SOLUTION: The substrate connecting structure 10 includes a printed circuit board 20 comprising a hard base-material 21 having first and second faces and a plurality of circuit patterns 23 arranged on the second face, a flexible circuit board 30 comprising a soft base-material 31 having first and second faces, and a plurality of circuit patterns 33 arranged on the second face, connections (connection regions) 24, 34 that connect the circuit patterns 23 of the circuit board 20 and the circuit patterns 33 of the flexible circuit board 30 to each other via a conductive connection material, and a heat-conductive layer 50 that is arranged on the first face of the flexible circuit board 30 and has a prescribed thermal conductivity higher than the thermal conductivity of the base-material 21 of the circuit board. The heat-conductive layer 50 faces part of the plurality of circuit patterns 33 of the flexible circuit board 30 via the base-material 31 and is arranged over part of the connection region and a region adjacent to the connection region. COPYRIGHT: (C)2011,JPO&INPIT
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