发明名称 ELECTROCHEMICAL DEVICE
摘要 Provided is an electrochemical device compatible with high-temperature reflow soldering using a lead-free solder. An electrical double layer capacitor 10-1 includes a package 14 that is constructed with a film or films and has sealed parts 14a1 to 14a3 formed by sealing parts, in which films are superimposed on each other, by, for example, heat sealing. The entireties of the sealed parts 14a1 to 14a3 of the package 14 are covered in a close-contact state with a support 16 that has higher rigidity than the film(s) constructing the package 14.
申请公布号 US2011056737(A1) 申请公布日期 2011.03.10
申请号 US20090933263 申请日期 2009.03.16
申请人 TAIYO YUDEN CO., LTD. 发明人 HAGIWARA NAOTO;ISHIDA KATSUEI;YAWATA KAZUSHI;KOYABASHI MOTOKI
分类号 H05K1/16 主分类号 H05K1/16
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