| 摘要 |
An exposure apparatus which projects a pattern of an original onto a substrate by a projection optical system, comprises a measurement device configured to measure a relative position between an original stage and a substrate stage via the projection optical system using an original-side fiducial plate and a substrate-side fiducial plate, and a controller, the original-side fiducial plate including first and second original-side marks, and the substrate-side fiducial plate including first and second substrate-side marks, wherein the controller is configured to control imaging characteristics of the projection optical system so that measurement of the relative position between the original stage and the substrate stage using the first original-side mark and the first substrate-side mark and measurement of the relative position between the original stage and the substrate stage using the second original-side mark and the second substrate-side mark can be performed simultaneously.
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