| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition capable of forming an interlayer insulating film or a surface protection film without occurrence of melt at the final heating step and with smaller sublimation of the cross-linking component and the like, and with smaller generation of gas component at the heating after the final heating step. <P>SOLUTION: The resin composition for an insulating film or a surface-protective film of electronic components includes: (A) a polymer having a structural unit shown by formula (I), and an acidic functional group or a group derived therefrom at both of the terminals; (B) a solvent; and (C) a specific ureido compound; wherein X<SB>1</SB>is a di- octa-valent organic group, Y<SB>1</SB>is a di- octa-valent organic group, R<SB>1</SB>is H or a 1-20C organic group, R<SB>2</SB>is H or a monovalent organic group, when a plurality of R<SB>1</SB>s or R<SB>2</SB>s exist, the plurality of R<SB>1</SB>s or R<SB>2</SB>s may be the same or different, p and q are independently an integer of 0-4, l and m are independently an integer of 0-2, and n is an integer of ≥2 indicating the number of structural units in the polymer. <P>COPYRIGHT: (C)2011,JPO&INPIT |
