| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead frame and an interposer that can attenuate electromagnetic noise, generated in the semiconductor package, in the semiconductor package. <P>SOLUTION: The lead frame is adapted to connect an LSI chip 10 to an external electric circuit, and has a plurality of leads 6. One lead 6a among the plurality of leads 6 has one end connected to the LSI chip 10 by a conductor 7a and the other end connected to a printed board, and is connected at the one end to an adjacent lead 6b by a conductor 7b, the lead 6b has the other end connected to one end of a lead 6c adjacent to the lead 6b through a conductor 7c, and the lead 6c has the other end made open. Consequently, the leads 6b and 6c connected to the lead 6a function as an open type stub line. <P>COPYRIGHT: (C)2011,JPO&INPIT |
