| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated substrate having a bump stabilized in height and having high connecting strength. SOLUTION: The laminated substrate includes a first substrate 10 having an electrode pattern 13 on a first surface thereof, a surface layer dielectric layer 12 provided on a first surface of the first substrate, and a through-hole 20 provided on the surface layer dielectric layer 12. The through-hole 20 is provided on the electrode pattern 13 and mechanically connected to the electrode pattern 13. The substrate further includes a bump 11 filled within the through-hole 20 to protrude from the surface of the surface layer dielectric layer 12. The opening width of the through-hole 20 opposite to the first substrate is set to be smaller than the maximum opening width within the surface layer dielectric layer 12. COPYRIGHT: (C)2011,JPO&INPIT |
