METHOD FOR USING DUMMY SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method for using a dummy substrate in a substrate processing equipment capable of suppressing a warp of a dummy substrate. SOLUTION: The method comprises a step for creating a history in film deposition including the kind and the thickness of a deposited film for a plurality of dummy substrates housed in a dummy substrate housing part respectively by using a computer based on a process recipe implemented in a processing chamber; a step for calculating a curvature of the dummy substrate by using the curvature data corresponding to change in curvature according to the film thickness and deposited film each of the kind of film and the history in film deposition of the dummy substrate and by computer based on this curvature data and the history of the dummy substrate; and a step for creating a conveying schedule based on the obtained curvature of the dummy substrate, the curvature data and the process schedule including the kind and the film thickness of the deposited film so as to suppress a warp of the dummy substrate. COPYRIGHT: (C)2011,JPO&INPIT