发明名称 CURABLE RESIN COMPOSITION
摘要 <p>Provided is a curable resin composition which exhibits improved developability even in through holes and can suppress the generation of development residue and which can yield a cured product with excellent heat resistance and hardness. A curable resin composition which comprises a carboxyl-containing resin, a photopolymerization initiator, and barium sulfate that has been pretreated with a dispersant having an acid group and/or a dispersant having a block copolymer structure, a graft polymer structure, and/or a star polymer structure.</p>
申请公布号 WO2011027526(A1) 申请公布日期 2011.03.10
申请号 WO2010JP05301 申请日期 2010.08.27
申请人 TAIYO HOLDINGS CO., LTD.;SHIINA, MOMOKO;ARIMA, MASAO;YAMAMOTO, SHUICHI;YOSHIDA, MASATO 发明人 SHIINA, MOMOKO;ARIMA, MASAO;YAMAMOTO, SHUICHI;YOSHIDA, MASATO
分类号 C08F290/00;C08G59/17;C08G59/58;G03F7/004;G03F7/027;H05K3/28 主分类号 C08F290/00
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