发明名称 |
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF |
摘要 |
A package substrate and a manufacturing method thereof are provided, including: forming a solder mask on a package substrate body having a plurality of conductive pads; forming a plurality of first-step openings in the solder mask by exposure and development; forming a plurality of second-step openings in the solder mask by a laser-based or plasma-based drilling process; and removing a solder mask foot from the bottom of each of the first-step openings so as to expose large surface areas of the conductive pads. Hence, the contact area between a conductive element and a corresponding one of the conductive pads is large enough to enhance bonding and electrical connection therebetween.
|
申请公布号 |
US2011056738(A1) |
申请公布日期 |
2011.03.10 |
申请号 |
US20090554087 |
申请日期 |
2009.09.04 |
申请人 |
PHOENIX PRECISION TECHNOLOGY CORPORATION |
发明人 |
HU WEN HUNG |
分类号 |
H05K1/11;B23K26/00;C25D5/02;G03F7/20 |
主分类号 |
H05K1/11 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|