| 摘要 |
<P>PROBLEM TO BE SOLVED: To miniaturize a device by efficiently cooling power semiconductors of a power conversion device. <P>SOLUTION: The power conversion device is configured such that the device includes a plurality of power semiconductors, a heat receiving member, a plurality of heat pipes, and a plurality of heat dissipation fins, the plurality of semiconductors are attached to one side of the heat receiving member, the plurality of heat pipes are attached to the other side of the heat receiving member, the plurality of heat pipes have heat receiving units which are thermally connected to the heat receiving member, part of the plurality of heat pipes has a heat dissipation part which is erected from both sides of the heat receiving units, the other part of the plurality of heat pipes has a heat dissipation part which is erected only from only one-end sides of the heat receiving units, the plurality of heat dissipation fins are attached to the heat dissipation parts of the plurality of heat pipes, and pipes of the heat dissipation parts of the heat pipes are arranged in zigzag alignment. <P>COPYRIGHT: (C)2011,JPO&INPIT |
