| 摘要 |
PROBLEM TO BE SOLVED: To provide a ball mounting method capable of reduce manufacturing cost by suppressing a waste of balls. SOLUTION: When balls such as solder balls are mounted on substrates 400 to be mounted, a cutting process of cutting a multiple patterning substrate 500 patterned with the plurality of substrates 400 to divide into the respective substrates 400 and electric inspection on the respective substrates 400 are performed in predetermined order, and balls are mounted only on substrates 400 determined as conforming articles through the electric inspection. In this case, a method is employed which performs the electric inspection on the respective substrates 400 after cutting and dividing the multiple patterning substrate 500 into the respective substrates 400 (after performing the cutting process). COPYRIGHT: (C)2011,JPO&INPIT |
