发明名称 THERMOCONDUCTIVE POLYCARBONATE RESIN COMPOSITION AND MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a polycarbonate resin composition excellent in thermoconductivity and molding workability, and reducing warpage of a molding, and the molding thereof. SOLUTION: This thermoconductive polycarbonate resin composition contains (C) 510-50 pts.wt. of graphitized carbon fiber having 400 W/(m×K) of longitudinal-directional thermoconductivity, and 5-20 μm of average fiber diameter, and (D) 10-80 pts.wt. of thermoconductive powder having a thermoconductivity of 10 W/(m×K) or more and 1-500 μm of average particle diameter, per 100 pts.wt. of polycarbonate resin alloy comprising (A) a polycarbonate resin and (B) a polyethylene terephthalate resin or a polybutylene terephthalate resin to be brought into 100:(10-70) of weight ratio, and the molding is obtained by molding the thermoconductive polycarbonate resin composition, and is useful as a casing for OA, electric and electronic components and precision equipment components. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011046967(A) 申请公布日期 2011.03.10
申请号 JP20100272157 申请日期 2010.12.07
申请人 MITSUBISHI ENGINEERING PLASTICS CORP 发明人 NAGASHIMA HIROMITSU;NAKANO HIROSHI
分类号 C08L69/00;C08K3/00;C08K5/00;C08K7/06;C08L67/02 主分类号 C08L69/00
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