发明名称 |
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which has a dummy pattern for keeping flatness of a wiring layer, and to provide a method of manufacturing the same. SOLUTION: The semiconductor device has a functional pattern required for achieving a function of a semiconductor device, and a plurality of dummy patterns in a prescribed layer of the semiconductor device together with the functional pattern. A plurality of dummy patterns of a first size are disposed and a plurality of dummy patterns of a second size are disposed in a region where a plurality of dummy patterns of the first size are not disposed. A plurality of dummy patterns of the second size are disposed between a plurality of dummy patterns of the first size and the functional pattern. A plurality of dummy patterns of the first size disposed in a first prescribed direction and a plurality of dummy patterns of the second size disposed in a second prescribed direction lie next to each other. The width between the dummy patterns of the first size is larger than the width between the dummy pattern of the second size. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2011049598(A) |
申请公布日期 |
2011.03.10 |
申请号 |
JP20100267184 |
申请日期 |
2010.11.30 |
申请人 |
RENESAS ELECTRONICS CORP |
发明人 |
YOSHIMUNE HIROYASU;SHINKAWATA HIROKI;SOEDA SHINYA |
分类号 |
H01L21/3205;H01L21/8242;H01L23/52;H01L27/10;H01L27/108 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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