COPPER FOIL FOR AN EMBEDDED PATTERN FOR FORMING A MICROCIRCUIT

摘要

Proposed is a copper foil for an embedded pattern, which has no nodule, and which comprises: a copper carrier layer; a barrier layer formed at one surface of the copper carrier layer; and a seed layer formed at a surface of the barrier layer to form a circuit. The barrier layer is a nickel layer or a nickel alloy layer, and the seed layer is a copper layer. The surface of the seed layer has an average roughness Rz of less than 1.5 µm, and Rmax of less than 2.5 µm.