发明名称 |
CHIP-TYPE EELECTRIC DOUBLE LAYER CAPACITOR AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
<p>PURPOSE: An array type chip resistor is provided to apply surface mounting technology by supplying a chip type electric double layer capacitor. CONSTITUTION: In an array type chip resistor, two electrodes(110,120) has electric terminal which is protruded from both sides respectively. A first separator(130) is arranged between two between electrodes. A second separator(140) is opposite to the first separator. An electric double layer part(100) comprises two electrodes, the first separator, and the second separator. A package houses the electric double layer.</p> |
申请公布号 |
KR20110025463(A) |
申请公布日期 |
2011.03.10 |
申请号 |
KR20090083543 |
申请日期 |
2009.09.04 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE, SUNG HO;RA, SENUG HYUN;PARK, DONG SUP;CHO, YEONG SU;LEE, SANG KYUN;JUNG, HYUN CHUL;JUNG, CHANG RYUL |
分类号 |
H01G11/00;H01G9/004;H01G11/22;H01G11/52;H01G11/66;H01G11/70;H01G11/74 |
主分类号 |
H01G11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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