发明名称 LIGHT IRRADIATION DEVICE, AND LIGHT IRRADIATION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a light irradiation device and a light irradiation method such that even when light, such as an ultraviolet ray, passed by an adherend to the one surface of which an adhesive sheet is stuck is reflected on the other surface side, the other surface side of the adherend is not damaged. <P>SOLUTION: The light irradiation device 10 which irradiates an adhesive sheet S having a layer of an ultraviolet curing type adhesive AD stuck to one surface of a semiconductor wafer W with an ultraviolet ray includes an ultraviolet lamp 12 disposed on the one surface side of the semiconductor wafer W, and a cover material 13 disposed on the other surface side of the semiconductor wafer W and blocking leakage of the ultraviolet ray passed by the semiconductor wafer W. A scattering means T of scattering incident light is disposed on the inner surface side of the cover material 13, and the scattering means T scatters the light to prevent the other surface of the semiconductor wafer W from being damaged. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011049264(A) 申请公布日期 2011.03.10
申请号 JP20090194935 申请日期 2009.08.26
申请人 LINTEC CORP 发明人 TAKANO TAKESHI
分类号 H01L21/301 主分类号 H01L21/301
代理机构 代理人
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