| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic thermometer manufacturing method which can reduce the occurrence of unevenness of assembly accuracy and allows low-cost manufacture, even when a structure connecting a temperature sensor and a printed circuit board via a lead wire is adopted. SOLUTION: The electronic thermometer manufacturing method includes a process for forming a first sub-assembly by fixing the temperature sensor on the printed circuit board through the lead wire, while positioning it; a process for mounting a sub case 50 on an assembly base 102, while positioning it by inserting a positioning standard pin 103 provided on the assembly base 102 into a positioning standard hole 58 provided in the sub case 50; a process for forming a second sub-assembly including the sub case 50 and the first sub assembly, by assembling the first sub-assembly on the sub case 50 positioned and mounted on the assembly base 102, while positioning it; and a process for housing the second sub-assembly in a casing, while positioning it. COPYRIGHT: (C)2011,JPO&INPIT |
