| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: an LED mounting structure with a small linear expansion coefficient difference to LED and an excellent thermal conductivity; a method of manufacturing the LED mounting structure; and a substrate for mounting LED for manufacturing the LED mounting structure. <P>SOLUTION: The LED mounting substrate is made by impregnating aluminum alloy into a porous body made of one or more types of particles chosen from the group consisting of silicon carbide, aluminum nitride, silicon nitride, diamond and graphite, with the fogging cast method. The aluminum alloy on the surface is etched to the surface roughness (Ra) of 0.5-10 μm after processing to 0.01-0.5 μm with a plate thickness of 0.05-0.5 mm. One or more types of metal layers chosen from the group consisting of Ni, Co, Pd, Cu, Ag, Au, Pt, Sn are formed. The area of 50-90% of the entire surface is made by exposing ceramic particles. The LED mounting structure using the substrate and the method of manufacturing the structure are also provided. <P>COPYRIGHT: (C)2011,JPO&INPIT |
