发明名称 WIRING STRUCTURE, METHOD FOR MANUFACTURING THE SAME AND DISPLAY DEVICE WITH WIRING STRUCTURE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring structure to which, in display devices such as an organic EL display and a liquid crystal display, a semiconductor layer and, for instance, an Al-based film that configures a source electrode and a drain electrode, can be stably and directly connected, and galvanic corrosion is not easily generated between the semiconductor layer and the Al-based film in an electrolyte solution used in a wet process, and the peeling of the Al-based film can be suppressed. <P>SOLUTION: In the wiring structure, the semiconductor layer 4 of a thin film transistor, and the Al alloy film 6 directly connected to the semiconductor layer 4 are formed on a substrate 1 in this order from a substrate 1 side. The semiconductor layer 4 is composed of an oxide semiconductor, and the Al alloy film 6 includes Ni and/or Co. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011049544(A) 申请公布日期 2011.03.10
申请号 JP20100168599 申请日期 2010.07.27
申请人 KOBE STEEL LTD 发明人 MAEDA TAKEAKI;GOTO YASUSHI
分类号 H01L29/786;G09F9/30;H01L21/28;H01L21/3205;H01L21/336;H01L23/52 主分类号 H01L29/786
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