发明名称 |
EPOXY RESIN COMPOSITION FOR PRINTED WIRING BOARD, RESIN FILM, PREPREG, METAL FOIL WITH RESIN, AND FLEXIBLE PRINTED WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for a printed wiring board with excellent storage stability. SOLUTION: The composition includes (A) an epoxy resin, (B) an epoxy resin curing agent, (C) a soluble polyamide, and (D) an inorganic filler as essential components. The soluble polyamide can enhance all of storage stability, adhesiveness, flexibility, and fillability. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2011046782(A) |
申请公布日期 |
2011.03.10 |
申请号 |
JP20090194502 |
申请日期 |
2009.08.25 |
申请人 |
PANASONIC ELECTRIC WORKS CO LTD |
发明人 |
ISHIKAWA YOSUKE;KOSEKI TAKAYOSHI;EZAKI YOSHIAKI |
分类号 |
C08L63/00;C08G59/04;C08K3/00;C08L71/10;C08L77/00;H05K1/03 |
主分类号 |
C08L63/00 |
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主权项 |
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