发明名称 EPOXY RESIN COMPOSITION FOR PRINTED WIRING BOARD, RESIN FILM, PREPREG, METAL FOIL WITH RESIN, AND FLEXIBLE PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition for a printed wiring board with excellent storage stability. SOLUTION: The composition includes (A) an epoxy resin, (B) an epoxy resin curing agent, (C) a soluble polyamide, and (D) an inorganic filler as essential components. The soluble polyamide can enhance all of storage stability, adhesiveness, flexibility, and fillability. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011046782(A) 申请公布日期 2011.03.10
申请号 JP20090194502 申请日期 2009.08.25
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 ISHIKAWA YOSUKE;KOSEKI TAKAYOSHI;EZAKI YOSHIAKI
分类号 C08L63/00;C08G59/04;C08K3/00;C08L71/10;C08L77/00;H05K1/03 主分类号 C08L63/00
代理机构 代理人
主权项
地址