| 摘要 |
PROBLEM TO BE SOLVED: To provide a prediction method for easily and accurately predicting a connection resistance value of a contact part between laminated bases when the bases each of which is composed of a wafer or a chip are mutually laminated. SOLUTION: The prediction method for predicting a connection resistance value includes a process for calculating a contact area (contacted area S<SB>1</SB>) between a first connection part and a second connection part in a surface contact part, a process for calculating a contact area (reference contact area S<SB>0</SB>) between a first reference connection part and a second reference connection part in a reference surface contact part formed by laminating a reference value setting first base including a first reference connection part having the same resistivity as that of the first connection part and a reference value setting second base including a second reference connection part having the same resistivity as that of the second connection part and allowing the first reference connection part and the second reference connection part to make surface contact with each other, a process for obtaining a connection resistance value (reference connection resistance value R<SB>0</SB>) of the reference surface contact part, and a process for calculating a connection resistance value R of the surface contact part by using R=R<SB>0</SB>ä1/(S<SB>1</SB>/S<SB>0</SB>)} (formula 1). COPYRIGHT: (C)2011,JPO&INPIT |
