SEMICONDUCTOR CHIP WITH CONDUCTIVE ADHESIVE LAYER AND METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A method of manufacturing a semiconductor chip with a conductive adhesive layer including steps of: forming a conductive adhesive layer on back side of a wafer on which a semiconductor element is formed; laminating a flexible substrate on back side of the conductive adhesive layer; forming a dicing groove which reaches from a front of the wafer to the conductive adhesive layer and a bottom of which is in the conductive adhesive layer; pressing from back side of the flexible substrate in such a way that the conductive adhesive layer is cut with the dicing groove as an origin point; and separating the flexible substrate from the conductive adhesive layer.