发明名称 Bonded assemblies and methods for improving bond strength of a joint
摘要 Bonded assemblies and methods for improving the bond strength of a joint are provided. The joint may be formed between bonding surfaces of a first and a second component. The first component has a bonding surface adapted to be bonded to a bonding surface of a second component. A plurality of features may be formed in at least one of the bonding surfaces. The bonding surfaces are bonded together to form the joint. A bonding material layer between the bonding surfaces may form the joint or the first and second components may be co-cured to form the joint. A chemical and mechanical bond between the bonding surfaces is formed with the plurality of features forming the mechanical bond and increasing the bond area of the chemical bond. The features may be openings and/or protrusions such as holes, slots, and bosses.
申请公布号 EP2292709(A2) 申请公布日期 2011.03.09
申请号 EP20100173479 申请日期 2010.08.20
申请人 HONEYWELL INTERNATIONAL INC. 发明人 GAGE, RAYMOND;ALLAN, ADRIAN
分类号 C09J5/00;B23K1/20;B23K20/00;B29C65/54;B32B7/12;B62D27/02;F01D5/28;F16B11/00 主分类号 C09J5/00
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