发明名称 Manufacturing method of a flexible printed circuit board and a structure thereof
摘要 <p>In a manufacturing method of a flexible printed circuit board (100) and its structure, the manufacturing method includes the steps of: providing a substrate (110); performs a preheating and drying process to the substrate; forming a circuit pattern including a ground circuit, a X-axis circuit, a Y-axis circuit and an external circuit on a surface of the substrate by a screen printing method, forming a ground circuit layer (120) on the substrate and corresponding to the ground circuit, forming on a Y-axis circuit layer (130) on a surface of the substrate and corresponding to the Y-axis circuit, forming a X-axis circuit layer (140) on a surface of the substrate and corresponding to the X-axis circuit, and forming a carbon paste enhancement layer (150) according to the external circuit.</p>
申请公布号 EP2173145(A3) 申请公布日期 2011.03.09
申请号 EP20090158889 申请日期 2009.04.28
申请人 CHOU, PO-JU 发明人 CHOU, PO-JU
分类号 H05K1/02;H05K3/24;H05K3/46 主分类号 H05K1/02
代理机构 代理人
主权项
地址