SPHERICAL SINTERED FERRITE PARTICLE, SEMICONDUCTOR SEALING RESIN COMPOSITION MAKING USE OF THE SAME AND SEMICONDUCTOR DEVICE OBTAINED THEREWITH

摘要

A resin composition for semiconductor encapsulation having goodmoldability, of which the cured product has effective electromagnetic wave shieldability, is provided. A resin composition for semiconductor encapsulation, containing spherical sintered ferrite particles having the following properties (a) to (c) : (a) the soluble ion content of the particles is at most 5 ppm; (b) the mean particle size of the particles is from 10 to 50 µm; (c) the crystal structure of the particles by X-ray diffractiometry is a spinel structure.