| 摘要 |
Copper is electroplated directly onto aluminum by immersing an aluminum workpiece in an aqueous alkaline plating bath containing a divalent copper salt and an amine capable of complexing the copper, and passing an electric current through the plating bath using the workpiece as the cathode. The deposits which are obtained are strongly adherent and the method avoids the need for complicated mechanical or chemical pretreatment of the workpiece. |
