| 摘要 |
<p>Formation of a fuse, which electrically connects 2 metal surfaces (2) that are arranged on a printed circuit board (4), comprises partially covering the 2 metal surfaces with a protective coating (5), while a partial region forming a contact region (2a) remains uncovered; applying liquid soft solder material (1) onto the 2 uncovered partial regions; and after the soft solder material has solidified, removing the protective coating in a surrounding area of the solder material to form receiving regions (2b), which are wetted by the solder material when the solder material fuses. Formation of a fuse, which electrically connects 2 metal surfaces (2) that are arranged on a printed circuit board (4) next to each other and spaced apart from each other, comprises: (1) partially covering the 2 metal surfaces with a protective coating (5), while a partial region forming a contact region (2a) remains uncovered; (2) applying liquid soft solder material (1) onto the 2 uncovered partial regions to bridge the gap between the 2 metal surfaces; and (3) after the soft solder material has solidified, removing the protective coating in a surrounding area of the solder material to form receiving regions (2b), which are wetted by the solder material when the solder material fuses, with the result that solder material flows off from a printed circuit board region between the 2 metal surfaces, and the electrical contact formed by the solder material is interrupted. An independent claim is included for a printed circuit board with a fuse.</p> |
