LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING THE LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE

摘要

PURPOSE: A light emitting device, a method for manufacturing the light emitting device, and a light emitting device package are provided to place a gap and a substrate with a high light transmittance rate under a light emitting structure layer, thereby emitting light generated in an active layer to the outside through the gap and the substrate. CONSTITUTION: A first contact layer(71a) is formed on a substrate(70). The first contact layer is electrically connected to an electrode(71). The second contact layer(71b) is formed on the lower side of the substrate. The second contact layer is electrically connected to the electrode. A light emitting structure layer(60) comprises a first conductive semiconductor layer(30), an active layer(40), and a second conductive semiconductor layer(50). An electrode part(80) is formed on the light emitting structure layer. A transparent conduction layer is formed between the substrate and the light emitting structure layer.