发明名称 |
DIE BONDER APPARATUS AND TRANSFERRING TOOL FOR DIE BONDER APPARATUS |
摘要 |
<p>PURPOSE: A die bonder and a transferring tool for the die bonder are provided to pick up and transfer devices loaded on a wafer by alternatively using a pair of pickers, thereby drastically increasing processing speed of a device by quickly transferring the device. CONSTITUTION: A lead frame(3) with a plurality of loading units(2) is loaded on a loading unit(100). The lead frame is unloaded from the unloading unit(200). A guide unit(300) guides movement of the lead frame from the loading unit to the unloading unit. A transfer tool(400) picks up devices from a wafer(10) and loads the devices on the loading unit. The devices are loaded on the wafer and transferred after the devices are cut.</p> |
申请公布号 |
KR20110024967(A) |
申请公布日期 |
2011.03.09 |
申请号 |
KR20090083165 |
申请日期 |
2009.09.03 |
申请人 |
JT CORPORATION |
发明人 |
YOU, HONG JUN;LEE, YONG SIK |
分类号 |
H01L21/677;B65G49/07;H01L21/60;H05K13/02 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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