发明名称 |
LIGHT EMITTING DEVICE, METHOD OF FABRICATING THE LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE |
摘要 |
<p>PURPOSE: A light emitting device, a manufacturing method thereof, and a light emitting device package are provided to form a protection member on a side of a light emitting structure, thereby preventing a light emitting structure from electrically short-circuited with an external electrode. CONSTITUTION: An ohmic layer(157) is formed on a light transmissive substrate(110). A light emitting structure(145) is formed on the ohmic layer. The light emitting structure comprises the first conductive semiconductor layer(130), the second conductive semiconductor layer(150), and an active layer(140). A base electrode(132) is formed on the bottom of the light transmissive substrate. A conductive via(131) is connected to the ohmic layer through the light transmissive substrate.</p> |
申请公布号 |
KR101020995(B1) |
申请公布日期 |
2011.03.09 |
申请号 |
KR20100014439 |
申请日期 |
2010.02.18 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
JEONG, HWAN HEE;LEE, SANG YOUL;MOON, JI HYUNG;SONG, JUNE O;CHOI, KWANG KI |
分类号 |
H01L33/38 |
主分类号 |
H01L33/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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