| 摘要 |
Cooling systems (1) suitable for cooling an electronic unit (2) or assembly. The cooling system is provided with a cooling channel (6). An electronic unit (2) rests over a heat-conducting cooler wall (7). A coolant guide apparatus (11) is provided in the cooling channel (6) and has insert conduit elements (13) for guiding the coolant onto the cooler wall indentations (12). The end of each insert conduit (13) opening to the cooling channel (6) may be provided with an inclined entry surface (19) and an inlet opening (20) towards the inner longitudinal channel (14). A plurality of such coolant guides (11) may be arranged in series so that, for example, the same cooling medium flows through a plurality of semiconductor modules in succession. |
